The upcoming generation of guided-wave structure, Substrate Integrated Waveguide (SIW) technology has expanded wide consideration since their inception. The principle of SIWs is to convert nonplanar structures into the corresponding planar form, enabling the planar fabrication, and processing of those nonplanar and 3D configurations. The opportunity to fabricate shielded structures by employing planar geometries has provided an amazing way to fabricate innovative resonators exhibiting very high-quality factors, suitable for filter and oscillator applications. Multilayered printed circuit board (PCB) or low-temperature cofired ceramic (LTCC) technologies and SIW approach allow reaching a high feasibility, planar integration and packaging degree.  SIW technology set up as a suitable candidate, which could fulfil the increasing demand of highly sophisticated RF front-end circuits and systems for satellite communication, 5G and new generation wireless systems, THz systems. SIWs inherit merits of those nonplanar counterparts and are promising for high frequency circuits, such as antennas, arrays, filters, portable microwave point-to-point systems, collision avoidance radars, vehicular communication systems, conformal /wearable circuitry, satellite antennas, etc. Therefore, these research domains are great-worth in ‘Substrate Integrated Waveguide (SIW) Based Circuits and Systems’ using novel materials and techniques.